76 PCB007 MAGAZINE I JULY 2023
In wet processing, the transport of thin materi-
als and substrates (less than 1 mil in thickness)
can be a rather tricky process. These materials
are vital in manufacturing flexible circuits, but
often this flexibility adds new challenges. Most
of these materials are easily damaged, and in
some cases
require well-
trained per-
sonnel to han-
dle them.
Changing market condi-
tions require changes in
approach. I-Connect007's
Barry Matties and Nolan
Johnson speak with Iso-
la's Travis Kelly, Sean Mir-
shafiei, and Kirk Thomp-
son about Isola's recent responses to mar-
ket conditions. In this interview, Kelly, Mir-
shafiei, and Thompson outline recent
changes to Isola senior leadership, optimiz-
ing manufacturing to meet the needs of the
global market, and the strategic importance
of advanced packaging to the global econ-
omy, and to the U.S., in particular.
How does a company protect its most valuable
electronics manufacturing information? How can
designs and processes be kept safe? IPC-1791 is
an industry-driven and industry-written standard
that focuses on protecting two things: controlled
unclassified information (CUI) and controlled tech-
nical information (CTI)—the information that would
be devastating for a company to lose.
An Exclusive Review of the Institute of Circuit
Technology's Annual Symposium
After a long crawl through heavy traffic on the M42 motorway, it was a
great relief to exit at Junction 6 and arrive at the National Conference
Centre for the 2023 Annual Symposium of the Institute of Circuit Tech-
nology on June 6. The conference center is co-located with the historic
National Motorcycle Museum and situated in the heart of the UK
midlands, a stone's throw from Birmingham International Airport.
Isola Changing With the Times
The Chemical Connection:
The Challenges of Thin Material
The Journey to IPC-1791 Validation
TOP TEN
EDITOR'S
PICKS
Bill Wilkie
Travis Kelly
