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76 PCB007 MAGAZINE I JULY 2023 In wet processing, the transport of thin materi- als and substrates (less than 1 mil in thickness) can be a rather tricky process. These materials are vital in manufacturing flexible circuits, but often this flexibility adds new challenges. Most of these materials are easily damaged, and in some cases require well- trained per- sonnel to han- dle them. Changing market condi- tions require changes in approach. I-Connect007's Barry Matties and Nolan Johnson speak with Iso- la's Travis Kelly, Sean Mir- shafiei, and Kirk Thomp- son about Isola's recent responses to mar- ket conditions. In this interview, Kelly, Mir- shafiei, and Thompson outline recent changes to Isola senior leadership, optimiz- ing manufacturing to meet the needs of the global market, and the strategic importance of advanced packaging to the global econ- omy, and to the U.S., in particular. How does a company protect its most valuable electronics manufacturing information? How can designs and processes be kept safe? IPC-1791 is an industry-driven and industry-written standard that focuses on protecting two things: controlled unclassified information (CUI) and controlled tech- nical information (CTI)—the information that would be devastating for a company to lose. An Exclusive Review of the Institute of Circuit Technology's Annual Symposium After a long crawl through heavy traffic on the M42 motorway, it was a great relief to exit at Junction 6 and arrive at the National Conference Centre for the 2023 Annual Symposium of the Institute of Circuit Tech- nology on June 6. The conference center is co-located with the historic National Motorcycle Museum and situated in the heart of the UK midlands, a stone's throw from Birmingham International Airport. Isola Changing With the Times The Chemical Connection: The Challenges of Thin Material The Journey to IPC-1791 Validation TOP TEN EDITOR'S PICKS Bill Wilkie Travis Kelly

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