SMT007 Magazine

Design | Fabrication | Assembly APCT.com | 4PCB.com • Rigid Through-Hole ~ Up to 40-Layers • Flex Applications ~ Up to 6 Layers • Oversized Boards ~ Up to 37" by 120" • Cavity Board Capability • Buried Resistor Capability • Introducing In-House Design ~ HDI, RF, Rigid Flex • HDI; Blind/Buried/Stacked Vias ~ Up to 8x Sequential Laminations • Rigid Flex Applications ~ Book Binder Capability • Heavy Copper ~ Up to 20 oz. • RF Technology Expertise • Heat Sink Bonding Capability • Introducing In-House Assembly ~ For NPI & Quick-Turn

• Cover
• Featured Content — Flying High With Digital Twin
• Additional Content
• Column — Digital Twin in Manufacturing
• Feature Interview — Lockheed Martin: Flying High With Digital Twin
• Infographic: F-35 By the Numbers
• Feature Column — Manufacturing Digital Twin: Spanners in the Works
• Short — Careers in Electronics: Aerospace Engineer
• Feature Interview — Drilling Down on Digital Twin
• MilAero007 Highlights
• Article — Manufacturing Isn't Linear; Stop Planning That Way
• Short — Good News for U.S. National Security
• Feature Article — It All Starts With Sensors
• Article — The Challenge of Traceability Data: A Call for Action
• Short — Purdue Engineers Create Continuously Tunable Thermal Regulators
• Column — A Tale of Two Lawn Mowers
• Short — Discovery May Lead to Terahertz Technology for Quantum Sensing
• Feature Article — The Vision: Virtual to Support Real Operations
• Column — AI in the Electronics Manufacturing Space
• SMT007 Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead