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Page 27 of 115

28 PCB007 MAGAZINE I SEPTEMBER 2023 to have some resident expertise, forward- thinking inspection equipment providers help by delivering "material agnostic" solutions to help alleviate the challenges. For example, moiré phase-shi interferome- try enhances the resolution of optical systems for defect detection, despite component reflec- tivity or substrate color, by providing detailed surface information, which then improves the sensitivity during inspection. Making use of moiré phase-shi interferometry to optimize lighting, imaging techniques, and contrast adjustments delivers trustworthy measure- ment-based inspection solutions. Furthermore, advanced data interpretation and analysis tools help make sense of the com- plex optical data generated during inspection. To achieve these accurate, reliable inspection results, some customization and calibration of optical inspection systems is essential. PCB007 Brent Fischthal is head of global marketing for Koh Young. With that deep understanding of the materials, how much of that resides with the EMS engi- neers and operators, and how much of that is built into the inspection equipment itself? ese new specialized materials need tailored approaches to inspection. Substrates oen fea- ture intricate microstructures and fine sur- face details. Optical inspection systems need to precisely capture these features and identify defects, which demands high-resolution imag- ing capabilities. While the manufacturer needs by Anaya Vardya AMERICAN STANDARD CIRCUITS There has always been pressure to reduce line and space as we have seen the bleeding edge tech- nology go from 8 to 5 mils and then to 3 mils. The difference between then and now is that the prior advancements, for the most part, used the same processes, chemistry, and equipment going from 8 mils to 3 mils. But going from 3-mil to sub 1-mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials. High density interconnect (HDI, the predecessor of UHDI) deals with line width and space, but primarily employs via structures to increase density. In broad terms, HDI printed circuit boards are defined as PCBs with one or more of the following via structures: microvias, stacked and/or staggered microvias, buried and blind vias, and all with sequential lam- ination cycles. Printed circuit board technology has been evolving with changing technology that demands smaller and faster features. HDI boards allow smaller vias, pads, lines and spaces—in other words, higher density. This increased density also allows a reduction in the number of layers and a smaller footprint. For example, one HDI board can house the functionality of multiple standard technol- ogy PCBs. Conventional state-of-the-art technology has been stuck at the 3-mil line and space capabil- ity for the longest time, but that is just not good enough to meet the increasingly tighter real estate con- straints of today's products. That is where Ultra HDI comes in. Continue reading in the September 2023 issue of Design007 Magazine. A Primer on UHDI Koh Young Multi-Projection Moire Demo.

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