Issue link: https://iconnect007.uberflip.com/i/1507822
4 PCB007 MAGAZINE I SEPTEMBER 2023 The SEL Supply Line Introduction by Barry Matties GreenSource Engineering: An Eye on Design with Michael Gleason and Rick Nichols Notion Systems: The Arrival of the 'Jet Age' with Antonio Schmidt Sigma Mecer: Turning Copper 'Green' with Andreas Littorin Schmoll: Pushing Drilling Forward with Stephan Kunz and Evan Howard Atotech: More Horizontal Panel Plating in the U.S. by Christopher R. Daczkowski Chemcut: Blending Capabilities and Culture with Mike Soble FEATURE INTERVIEWS The Drive Toward UHDI and Substrates with Darren Hitchcock Cutting-edge Inspection Challenges Q&A with Brent Fischthal Pivoting on Substrates with Oved Shapira FEATURE ARTICLE What is Ultra HDI? by Happy Holden FEATURE COLUMN Convergence by Nolan Johnson SEPTEMBER 2023 • FEATURED CONTENT New demands on PCB fabrication, namely advanced packaging, ultra high density intercon- nect (UHDI), and new specialty materials, are converging, changing the landscape of our business; so is the CHIPS Act. Is it time to start paying close attention to this convergence? Finding Ultra 54 56 60 64 68 72 78 10 24 30 18 8 S E L S P E C I A L S E C T I O N