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74 PCB007 MAGAZINE I SEPTEMBER 2023 e new generation of MKS' Atotech hori- zontal lines are usually equipped with advanced copper plating units, which offer a higher fluid performance via increased pump power and fluid control capability compared to the standard Uniplate Cu lines. is additionally enhances the filling performance, especially for high aspect ratio boards, and enables more plating capabilities. Uniplate stands for uniform plating results, which incorporates key technology features to enable: • A uniform solution exchange based on patented flood bar technology • Fully automatic control loops for critical bath solution parameters • Auxiliary equipment for automatic replen- ishment of the chemistry. is includes the Oxamat for the desmear portion or the copper dissolving tank for automatic control of the iron copper concentration in the electrolytic copper plater. Another feature for more uniform copper deposition is the turn gap adjustment (TGA), which picks up the panel utilizing a robotic arm and turns it 180 degrees to change the clamp- ing position from one Cu plater unit to the next. Both lines are configured with optional features for process control, such as pH-control, con- ductivity measurement, and analyzer units to measure and control the critical process param- eters, maintain them, and track them for quality control functions. Customers benefit from an automatic and tighter process control window, which results in high-yield production with less scrap and waste as well as reduced water, chem- istry, and energy consumption. ese produc- tion lines are equipped with several particle control features, such as fine-line filtration units and automatic cleaning equipment to minimize the impact of particles on yield rates. Meeting Our Customer's Specific Needs Traditionally, the MKS' Atotech lines are tailored to the specific needs of its customers. Figure 2: Fully automatic cleaning equipment.