Issue link: https://iconnect007.uberflip.com/i/1507822
info @ atotech.com www.atotech.com Leading Immersion Tin for Flip Chip applications For more information on our company or products, just scan the QR-code. Horizon Stannatech ® IC – Equipment, chemistry, and automa on in one solu on The industry is increasingly looking into highly reliable copper/tin intermetallic compounds (IMC) for manu- facturing Package Substrates / Flip Chips (FC-CSP or FC-BGA). Today, we offer a mass-production proven, highly trusted manufacturing solution for immersion tin Flip Chip applications to some of the world's leading manufacturers. Highly reliable surface finishing results, maximum yield, resistance to multiple reflow circles, long storage, and more are all important criteria that make the Atotech Immersion Tin (POR) solution a trusted option for Flip Chip applications today. The combination of the Atotech ® Horizon ® Stannatech ® system with the Stannatech ® 2000 process provides our customers with a series of additional benefits, such as reduced particle impact, minimized dewetting failure, and increased production runtime. Our Horizon ® Stannatech equipment comes together with a patented flood bar design for an optimized solution flow. Its fine-line filtration feature achieves optimal particle control and is fast and hassle-free with a fully automated cleaning procedure. Customers can also benefit from our auxiliary equipment, Constannic ® , and Crystalizer ® , that keep the bath solution stable and help reduce chemistry consumption.