Issue link: https://iconnect007.uberflip.com/i/1508761
OCTOBER 2023 I SMT007 MAGAZINE 23 process? What will this be in the foreseeable future? • Is there a requirement for multiple bottom terminated devices? • Is there a requirement for inspection of tall devices up to 25 mm? • Is there a requirement for wafer-level devices with highly reflective surfaces? Scutchfield: Considerations can be a bit dif- ferent depending on the inspection applica- tion, but the core features and considerations center around selection of a provider/part- ner which can serve all current and potential future needs, and to not make the mistake of looking at the system being acquired as a one- time buy. e needs you have today are just that, and chances are good that your needs will expand over time, especially as you learn what multiple inspection points on the line can do for you. Selecting a provider that has a very proven track record with systems that serve all the various inspection functions on the SMT line, and has the strong commitment to developing the soware tools to tie all sys- tems together and truly enable Smart factory realization, is what will ensure your business will be taken to the next level. You will have the opportunity to remain state of the art and cut- ting edge with your SMT operation. worthy result. e success of the inspection effort depends on a combination of the cam- era, optical resolution, and the number of images acquired, along with pattern creation source (digital, analog, or both). ese com- binations result in a data set, and size of the data set which needs to be processed and ana- lyzed. In most cases the more data, the better the image clarity and more accurate the results the system can provide. But large data sets take longer to process, especially if many tests are being executed. To be fully capable of meeting both superior image acquisition and fast pro- cessing (fact inspection cycle times), systems must employ all features and capabilities, plus both powerful and very optimized algorithms. Virani: Machine vision and, in particular, machine learning, helps to overcome the limitations of traditional automated inspec- tion systems. By automating the program- ming step, one can significantly increase pro- ductivity, as the system can quickly learn new boards with ease and accommodate variations in board designs and components used. More- over, machine learning makes defect detec- tion more robust, reducing false positive rates while maintaining high defect detection rates. Additionally, it enables us to inspect objects that were previously only possible with human operators. What criteria should be considered when selecting an automatic inspection system for a specific electronics manufacturing process? D'Amico: e criteria considered for select- ing any automatic inspection system is really based on the manufacturer's budgetary and production requirements. We should consider: • What are the manufacturer's budgetary requirements? • Is this an in-line or off-line production application? • What is the smallest component that is currently used in the manufacturing (Source: MIRTEC)