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OCTOBER 2023 I SMT007 MAGAZINE 67 Koh Young's Brent Fischthal explains how UHDI and advanced packaging are challenging inspec- tion systems. Advanced packaging seems to be accelerating the trend toward larger component packages. What are the new demands/challenges these packages put on inspection? Brent Fischthal: The shift toward larger components and advanced packaging brings a host of chal- lenges that impact the industry. These challenges include com- plexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach. First, the increased complexity associated with advanced packaging techniques introduces more intricate board designs with multiple chip types and miniaturized components. Furthermore, the drive toward higher density and smaller pitch, facil- itated by advanced packaging solutions such as 2.5D and 3D packaging, places significant demands on inspection machines. For instance, inspection systems must reliably address challenges like 10 mm thin solder deposits, 50 mm component spacing, and highly-reflective components within densely popu- lated areas, even where access might be limited. Moreover, the proliferation of diverse advanced packaging methods, including fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplets, requires inspection machines to accom- modate a wider variety of package types and con- figurations. In addition, the variation in component Benson to sign. It was going to be a good day, indeed. Initially, Patty was disappointed in Paul. Clearly, she thought, he did not do a thorough job. at was, until Paul continued to speak. "Yes, Excel's cost of ownership is lower, but when profitability potential is considered, Pin- nacle's potential is much greater," Paul elabo- rated. At this, the murmuring increased to an unset- tling point. Hal started to fume. What will Paul's profitability potential reveal? Will Hal stay calm? Stay tuned to find out. SMT007 Ronald C. Lasky is an instruc- tional professor of engineer- ing for the Thayer School of Engineering at Dartmouth Col- lege, and senior technologist at Indium Corporation. To read past columns, click here. heights, a common characteristic in advanced pack- aging due to designs like stacked die and heteroge- neous packaging, requires the inspection system to overcome the shadowing created by these height differences in order to make consistent and reliable measurements. To continue reading, click here. Cutting-edge Inspection Challenges