SIGNIFICANTLY IMPROVE
SOLDER BALL/JOINT
AND SHOCK-DROP RELIABILITY
Integrates seamlessly with existing SMT lines and tape and reel feeders
Tested with lead-free solders and lead-free assembly processes
No additional equipment needed
No PCB pre-bake required
No additional cure cycle required
100% reworkable
Long
shelf life
PLACE-N-BOND™ UNDERFILMS
1-847-394-5800 | alltemated.com
Underfilm
Underfill
