SMT007 Magazine

SMT007-Oct2023

Issue link: https://iconnect007.uberflip.com/i/1508761

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SIGNIFICANTLY IMPROVE SOLDER BALL/JOINT AND SHOCK-DROP RELIABILITY Integrates seamlessly with existing SMT lines and tape and reel feeders Tested with lead-free solders and lead-free assembly processes No additional equipment needed No PCB pre-bake required No additional cure cycle required 100% reworkable Long shelf life PLACE-N-BOND™ UNDERFILMS 1-847-394-5800 | alltemated.com Underfilm Underfill

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