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MARCH 2024 I SMT007 MAGAZINE 85 IPC's strategic vision is to build its leadership position on topics and issues that drive change for the industry. With these goals in mind, IPC has created the Thought Lead- ers Program (TLP), comprised of industry experts who will assist IPC on key industry issues and offer valuable insights to IPC members and key external stakeholders. Ansys will strengthen Schaef- fler's digital thread by democratizing simulation and improving material intel- ligence across engineering disciplines. For example, including data about material composition in the research and development process will result in more inno- vative and sustainable products. Winners were selected by members of the conference technical committee. This year awards were given for the "Best of Pro- ceedings" category but also for a new des- ignation of "Best Practical and Applica- tions-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements. The authors will receive their awards during a ceremony at SMTA International 2024. SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Den- sity Interconnect Symposium will be held at the Peoria Sports Complex. This event sets the stage for researchers, engineers, designers, and academia to address the complexities and innovations reshaping the world of Ultra HDI technology. The global semiconductor manufacturing industry recovery is taking hold with elec- tronics and IC sales increasing in the final quarter of 2023 and more growth projected for 2024, SEMI announced in its fourth quar- ter 2023 publication of the Semiconductor Manufacturing Monitor (SMM) report. Yamaha Robotics SMT Section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, includ- ing faster board han- dling, multi-compo- nent alignment check- ing, and enhanced LED coplanarity measurement. For the latest news and information, visit Ansys, Schaeffler Collaboration Drives Sustainable Product Development Best Papers from SMTA International Announced Yamaha Introduces Latest Upgrades to its 3D AOI Systems Global Semiconductor Manufacturing Industry Poised for 2024 Recovery, SEMI Reports Brain Power on Tap: IPC's Thought Leaders Program Provides Insights on Key Issues SMTA Introduces Ultra High Density Interconnect (UHDI) Symposium Michael Carano

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