Issue link: https://iconnect007.uberflip.com/i/1516724
24 SMT007 MAGAZINE I MARCH 2024 Feature Article by Julia Gumminger IPC e ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Spe- cial Technical Sessions on ursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and inno- vations. Both sessions were curated by the Tech- nical Program Committee (TPC), consisting of subject matter experts in their fields. Session 1: Advanced Packaging From 8:30 to 11 a.m., IPC Chief Technol- ogy Officer Matt Kelly will provide the latest insights from industry experts on next-gener- ation IC substrate and UHDI needs for next- generation advanced packages. Application workloads (including AI), high-performance computing, and 5G/6G wireless communica- tions, among others, drive the need for faster, higher bandwidth, more powerful proces- sors, and more memory. Significant changes in semiconductor architectures and designs using chiplet-based, heterogeneous integration approaches are well underway. ese changes directly impact IC substrates that interconnect directly with semiconductor chips and UHDI- printed circuit boards needed to connect the electronic package to the rest of the system. Please join us for this important session that will provide a big picture of the needs for next- generation substrates, insights on the chal- lenges of fabricating UHDI PCBs vs. IC sub- strates, discussion on next-generation organic build-up substrate advancements, and future substrate R&D needs and challenges. Addi- tional speakers representing companies such as Intel, AT&S, Resonac, AMKOR, and Dia Nippon Printing will dive deeper into these important issues. ECWC16 Technical Conference Special Sessions