Issue link: https://iconnect007.uberflip.com/i/1516724
44 SMT007 MAGAZINE I MARCH 2024 of confidence that it has been designed for extended life in the field." Dr. Tim Burke, chief tech- nology officer at Arch Sys- tems, will provide an introduc- tion to machine data analytics in the EMS industry. "As EMS manufacturers advance toward Industry 4.0 and the Factory of the Future, there are massive opportunities to leverage the large-scale capture and analysis of machine data to improve almost all aspects of factory operations," he says. In this course, Burke will cover domain-specific forms of data analysis appropriate for the EMS industry on top of machine data such as what is produced by SMT machines inside an EMS factory. e course assumes familiarity with SMT equipment such as PnP machines, SPI/AOI machines, and solder paste printers. He covers topics rang- ing from what kind of data is produced by these machines, how to visualize time series of parameters from machines, examples of iden- tifying specific machine problems in the data, and freely available open-source tools that are appropriate for analyzing EMS machine data. Cecelia Rios, rework and repair technician at Hi-Tek Electronics, will discuss solder tech- niques. Students will leave with an ability to identify parts and know how to solder in accor- dance with classes 1, 2, or 3. Dr. John Lau, senior proj- ect assistant at Unimicron, will present a course titled, "Chiplet Design and Heterogenous Integration (SiP)." Chiplet is a chip design method, and het- erogeneous integration is a chip packaging method. "Chiplet design and heterogeneous integration packaging have been generating a lot of traction lately," Lau says. "For the next few years, we will see more implementations of a higher level of chiplet designs and hetero- geneous integration packaging, whether for cost, time-to-market, performance, form fac- tor, or power consumption. His lecture will cover the reasons behind chiplet design, how it relates to heterogenous integration packag- ing, lateral communication between chiplets, and multiple systems in various scenarios. Design engineer Vern Sol- berg will teach two courses. is first tutorial will furnish the design for manufacturing principles established for flex- ible and rigid-flex circuit fab- rication. Additionally, guidance will be pre- sented in developing surface mount compo- nent land pattern geometry and methods for providing the physical reinforcement criteria that will contribute to ensuring quality, reli- ability, and manufacturing efficiency. e second course "will furnish PCB design engineer guidance for developing and imple- menting the new generations of advanced mul- tiple function semiconductor packaging tech- nology, high-density circuit boards, as well as ultra-high-density interposers," Solberg says. "Driven by the need to maintain a competitive edge and technical advantage, product devel- opers are relying heavily on more innovative IC package solutions. Although integrating several semiconductor functions onto a single die element (system-on-chip) appears to pro- vide a viable solution for some, development cost and time have oen proved excessive. On the other hand, semiconductor companies, working together with other companies, are establishing the universal chiplet interconnect express (UCIe) standard as a high-bandwidth, low-latency connector for those computing blocks to communicate inside a chip and lead the ecosystem to create the UCIe Consortium. Frank Richter, CEO of Greenectra will provide a com- prehensive introduction to Li- ion battery technology. "We cover the main topics needed to understand how Li-ion bat- teries work as well as the challenges for the implementation within battery systems," Rich- ter says.