Issue link: https://iconnect007.uberflip.com/i/1516724
56 SMT007 MAGAZINE I MARCH 2024 into BGA PCBs manufactured via traditional methods. e conformal vertical interconnects were made using aerosol jet printing (AJP) in five-axis configurations, and the interconnects that connected the interposer to the BGA leads were printed using syringe-dispense meth- ods. is work expands on the prior research by using the optimized parameters and design of experiments to implement AM interposers into a dual-channel, X-band MMIC assembly. Using both AM and traditional manufactur- ing methods in tandem, the advantages of both methods are leveraged to optimize manufac- turing processes. SMT007 market. e process development and optimi- zation can be carried out by soldering a PCB with the digital twin of a soldering machine. During production ramp-up, the solder pro- cess parameters can be optimized to maximum productivity at high solder quality. "Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly" Presenter: Emily Lamport, PhD student at University of Massachusetts Lowell Additive manufacturing (AM) offers numerous ben- efits over traditional manu- facturing methods, such as realization of unique form factors, decreased waste in material, decreased cost and lead time of tools, and the ability to create rapid prototypes. It is for these reasons that there has been a sig- nificant increase in its use in different techni- cal applications, including electronic packag- ing. In previous studies, AM techniques have been used to create poly-ether-ether-ketone (PEEK) Near Chip-Scale Interposers (NCSIs) Figure 1: The machine learning model gives green light for production start, as sufficient solder hole-fill is to be expected. (Courtesy: Sentinum GmbH)