MARCH 2024 I SMT007 MAGAZINE 85
IPC's strategic vision is to
build its leadership position
on topics and issues that drive
change for the industry. With
these goals in mind, IPC has
created the Thought Lead-
ers Program (TLP), comprised
of industry experts who will assist IPC on key
industry issues and offer valuable insights to IPC
members and key external stakeholders.
Ansys will strengthen Schaef-
fler's digital thread by
democratizing simulation
and improving material intel-
ligence across engineering
disciplines. For example, including data about
material composition in the research and
development process will result in more inno-
vative and sustainable products.
Winners were selected by members of the
conference technical committee. This year
awards were given for the "Best of Pro-
ceedings" category but also for a new des-
ignation of "Best Practical and Applica-
tions-Based Knowledge." A plaque is given
to primary authors of all winning papers
for these exceptional achievements. The
authors will receive their awards during a
ceremony at SMTA International 2024.
SMTA is excited to introduce a new event
for the electronics manufacturing industry
which takes place on March 26, 2024 in
Peoria, Arizona, USA. The Ultra High Den-
sity Interconnect Symposium will be held
at the Peoria Sports Complex. This event
sets the stage for researchers, engineers,
designers, and academia to address the
complexities and innovations reshaping
the world of Ultra HDI technology.
The global semiconductor manufacturing
industry recovery is taking hold with elec-
tronics and IC sales increasing in the final
quarter of 2023 and more growth projected
for 2024, SEMI announced in its fourth quar-
ter 2023 publication of the Semiconductor
Manufacturing Monitor (SMM) report.
Yamaha Robotics SMT
Section has revealed
performance-boosting
upgrades for the YRi-V
3D AOI system, includ-
ing faster board han-
dling, multi-compo-
nent alignment check-
ing, and enhanced LED
coplanarity measurement.
For the latest news and information, visit SMT007.com
Ansys, Schaeffler Collaboration
Drives Sustainable Product
Development
Best Papers from SMTA
International Announced
Yamaha Introduces Latest
Upgrades to its 3D AOI Systems
Global Semiconductor
Manufacturing Industry
Poised for 2024 Recovery,
SEMI Reports
Brain Power on Tap: IPC's Thought
Leaders Program Provides Insights
on Key Issues
SMTA Introduces Ultra High
Density Interconnect (UHDI)
Symposium
Michael Carano
