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www.atotech.com Revolutionizing gold plating for superior ENIG-corrosion preventi- on and environmental safety In the dynamic world of printed circuit board (PCB) manufac- turing, where innovation is paramount, Atotech's Aurotech ® G- Bond 3 emerges as a breakthrough solution in Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), and Electroless Palladium Autocatalytic Gold (EPAG) plating processes. This revolution - ary solution not only surpasses its predecessor, Aurotech ® G-Bond 2, but also introduces innovative features, such as a non-toxic stabilization. It therewith sets new industry standards and addresses environmental concerns. Superior protection and longevity The G-Bond 3 electrolyte has remarkable autocatalytic plating properties that powerfully mitigate potential corrosive attacks on the underlying nickel layer. This feature allows for high gold thicknesses of up to 300 nm and more during the plating process. The autocatalytic nature of the process represents a significant step forward in corrosion-free gold electrolytes. It meets the industry's demand for increased reliability. A safer and greener approach A key advantage of the new solution is its non-toxic stabilization. By eliminating the need for hazardous potassium cyanide (KCN) replenishment, the process significantly improves user safety. The removal of toxic substances streamlines process handling, reducing risks and enhancing overall operational safety measures. This move towards a completely KCN-free stabilizer aligns with the industry's commitment to environmental sustainability. A cost-effective solution The Aurotech G-Bond 3 electrolyte also revolutionizes cost- competitive manufacturing. It optimizes production costs with a low gold content of 0.6 g/l and an exceptional thickness distri - bution of less than 5% CoV. This cost-effective solution not only minimizes drag-out losses but also allows for a low target thick- ness, thereby effectively optimizing overall production costs. The process builds on the advantages of its predecessor, Aurotech ® G-Bond 2, by introducing an unprecedented level of stability and further improving bath life by up to 10 MTO. These improve- ments result in reduced maintenance and lower operating costs, making it an economical and efficient choice for manufacturers. Flexibility for manufacturers Versatile use in plating processes, including Ni/Pd/Au and Pd/Au deposits, is possible due to the unique composition of the new process. As a result, system operators benefit from greater flexibility in their final finish production. This potentially saves space and time and reduces warehouse stock. Corrosion mitigation in ENIG In response to industry demands for corrosion mitigation in ENIG processes, the autocatalytic properties of the Aurotech G-Bond 3 solution significantly reduce the risk of corrosive attacks on the nickel layer. It meets industry standards with an outstanding > 95% level 0 corrosion rating according to IPC 4552B. The Aurotech G-Bond 3 electrolyte represents a paradigm shift in corrosion-free gold electrolytes for ENIG, ENEPIG, and EPAG plating processes. Its autocatalytic plating behavior, non-toxic stabilization, and versatile applications set new industry stan - dards. Manufacturers benefit from improved stability, re duced maintenance efforts, more versatile shopfloor management, and cost-competitive manufacturing. This places the new process at the forefront of electroplating technologies. The innovative solution not only ensures enhanced efficiency but also prioritizes environmental safety, making it a top choice in the evolving surface finish landscape. Sandra Nelle Global Assistant Product Manager Atotech Deutschland GmbH & Co. KG Materials Solutions Division MKS Instruments Defect-free gold layer and interface