114 PCB007 MAGAZINE I MARCH 2024
When I learned
this issue would
be dedicated to
optimizing the
bare board fab-
ricator's experience at IPC APEX EXPO
2024, I thought it would be an easy column
to write. With more than 40 of these shows
under my belt, I didn't think it would be too
difficult to come up with a list of dos and
don'ts to make your visit to an exhibitor's
booth worthwhile. The whole point of being
at the show in the first place is to introduce
new products, meet and talk with old cus-
tomers, and introduce yourself and your
product to potential new customers.
We are often so
immersed in what we are
doing that we don't have
time to lift our heads and
open our eyes to the
possibility of opportu-
nity. Why is this a prob-
lem? It's because being
open to opportunities is crucial for success in
sales. The absolute best way is to always have
an open mind. You must also be able to con-
nect the dots, to see something a company is
doing that makes them successful and whether
you can apply it to your own business—no mat-
ter the industry.
In a previous column, the critical process of desmear and its neces-
sity to ensure a clean copper surface connection was presented.
Now, my discussion will focus on obtaining a void-free and tightly
adherent copper plating deposit on these surfaces. After the
desmear process, the task is to insure a continuous, conductive, and
void-free deposit on the via walls and capture pad. Today, there are
several processes that can be utilized to render vias conductive.
What PCB Fabricators Should Know About IPC APEX EXPO 2024
In this article, we focus on how bare board fabricators can maximize their
time and investment at the show. We visited with Matt Kelly, IPC chief
technologist, and Julia Gumminger, IPC professional development and
events manager, as well as Udo Welzel and Stanton Rak, the chairs of the
technical program committee, to discuss the technical depth and breadth
that the 2024 show will bring to fabricators and professionals all along the supply chain.
It's Only Common Sense: Seeking
the Possibility of Opportunity
The Chemical Connection:
An Exhibitor's View of IPC APEX
Trouble in Your Tank: Processes to Support IC Substrates and
Advanced Packaging, Part 4
TOP TEN
EDITOR'S
PICKS
Dan Beaulieu
