Issue link: https://iconnect007.uberflip.com/i/1517668
Global Ultra High Density Interconnect Feature and Process Control System for improved fine feature imaging to 4 µm. Improved dynamic registration technology to improve laser to mechanical drill registration. Increased throughput via offline registration technology. High power, Quad-wave, data streaming light engine for high resolution imaging. Multiple resolutions including 4, 6, 15, 30 µm features for conventional processes. External Rasterization provides 10x percision for fine feature adjustment on the fly. Sub-1 mil UHDI Capability High Throughput Automation Ready 15,6,4, and 1 µm available SAP proven to 10 µm MivaTek Global, LLC, 6 Dickinson Drive, Suite 218, Chadds Ford, PA 19317 Website: www.MivaTek.Global Contact: Brendan Hogan M (610) 620-3795 b.hogan@MivaTek.Global