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Corporate Headquarters: 3990 Concourse, #425 • Ontario, CA 91764 • ph: (909) 466-5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • Ph: (860) 793-4011 The Global Leader in Final Finish Technologies www.uyemura.com Booth 4809 • Etchbond micro-roughening • Anisotropic etchants • Flash etchants for SAP • Differential etchants for mSAP • Micro via fill MEC from Uyemura Provides Industry's Roadmap for High Density & Ultra High Density Circuits • TWX-42 RAIG (Reduction-Assisted Immersion Gold) deposits 6-8 m gold with zero nickel corrosion. • Talon 3 electroless palladium: the foundation for ENEPIG, EPIG and EPAG final finish layer deposits • TPD-23 electroless pure palladium for ENEPIG and wire bond applications • Direct Immersion Gold for dense, non-porous deposits up to 0.3 m; meets highest standards for HF and fine pattern compatibility