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64 DESIGN007 MAGAZINE I AUGUST 2024 using an IPD can simplify PCB assembly pro- cesses and lower assembly and final product costs. is IC-like manufacturing process would involve depositing thin layers of resistive, dielectric, and conductive materials onto a suit- able substrate (oen silicon, glass, or ceramic) using physical vapor deposition (PVD) or chemical vapor deposition (CVD). However, it is also possible to assemble an IPD discrete device using a traditional SMT process and solder to mount the resistors, capacitors, and inductors to a small PCB or ceramic circuit that has terminations at designated locations (Figure 1). Many good ideas have oen escaped broader appreciation in the electronics industry. Some have come in and out of favor over time, includ- ing the integrated passive device (IPD). e first IPDs appeared in the late 1980s and early '90s, driven by a desire to minia- turize electronics while decreasing cost and increasing performance. ose drivers remain key today. Just like an IC package, engineers integrate resistors, capacitors, inductors, etc., into a packaged device, and then mount and interconnect them to a printed circuit board. is can significantly reduce the number of discrete components that might other- wise be required for an assembly design, and Integrated Passive Devices: Design Solutions With Many Benefits Flexible Thinking by Joe Fjelstad, VERDANT ELECTRONICS Figure 1: An IPD (integrated passive device) can integrate numerous discrete devices into a single package, thereby reducing the number of components that would otherwise require individual handling, validation, and assembly. (Source: Murata)