Issue link: https://iconnect007.uberflip.com/i/1528798
46 SMT007 MAGAZINE I NOVEMBER 2024 Interview by Nolan Johnson I-CONNECT007 A new IPC white paper, "Advanced Packaging to Board Level Integration— Needs and Challenges," authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief tech- nology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexi- ties of advanced packaging technol- ogy and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly impli- cations. Nolan Johnson: Your white paper on advanced packaging is a very techni- cally deep, insightful piece with great detail. What's the ultimate goal? Matt Kelly: Our intent was to go one layer deeper into our silicon-to-systems messaging. You've heard this phrase as a way to describe what's happening at the front end of the supply chain, from chips to the final system. e report begins by talking about applications. It's impor- tant to understand that advanced pack- aging is very broad, so we break down what it means to drive market segments. Advanced Packaging: Preparation Is Now