Issue link: https://iconnect007.uberflip.com/i/1528798
48 SMT007 MAGAZINE I NOVEMBER 2024 For example, advanced p a c k ag i ng m e a n s d i f - ferent things in differ- ent applications, such as high-performance com- put ing ( H P C), 5G/6G wireless communica- tions, autonomous driv- ing and EV automotive, medical electronics, and aerospace and defense systems. Depending on the type of environment and product you're dealing with, the challenges, needs, and requirements for what these advanced packaging techniques can deliver will vary. is report is important because it combines two concepts—component-level packaging (CLP) and system-level packaging (SLP)— which are obviously related. It's important to convey that the amount of time, effort, and investment IPC has made to stay on top of changes with advanced packag- ing will be ongoing and is here to stay. A long time ago, someone taught me that "everything follows silicon"; just watch what it does, and everything else will follow. at lesson holds true here, too. People are already doing a lot of this work. Products and devices are using this technology as we speak. is is not "someday"; it's actually happening now. But as with every- thing else, there's breadth to this for the enti- ties unaware of these challenges. We know it's important for our membership and the indus- try that we stay on top of this. Most importantly, we're not just reporting information but rather giving it a subject mat- ter expert assessment by discussing and ana- lyzing it. What are the impacts for a designer, PCB fabricator, assembler, or manufacturer making new components? It's important that we identify and digest this and give recommendations and key high- lights of what's happening. You've heard me say many times that a component by itself, while it's really amazing, doesn't do anything until it's attached to a larger circuit system and board. Devan, the report clearly shows that component-level (CLP) and system-level (SLP) packaging receive a lot of attention. Devan Iyer: at's right. With CLP, there is a lot of integration happening that includes sin- gle-chip and multi-chip heterogeneous inte- gration. Multi-chip heterogeneous integration brings different silicon technology nodes integrated into one package. Different material sets, sili- con, and non-silicon devices can be integrated into one package or module in a heterogeneous integration technology. ose heterogeneous integrations happen inside a CLP. e challenges associated with integrating CLP into a board are multifold. You need to really look at the design elements. How do you design the PCB to cater to the require- ments of a complicated CLP—a heterogeneous integrated package? What material sets must be used to integrate those packages into the board? What type of solders and interface materials do you need? As CLPs become increasingly complicated, these questions need to be extensively studied. e next point we address is to be very mind- ful of the assembly processes, which are the PCB assembly processes typically used in the EMS world. How will these packages be sock- eted? How will they be integrated with sockets and/or without sockets? Finally, we address the reliability and char- acterization of these complex packages as we integrate them into the board or as we assem- ble them. In addition to the application space and the differentiation of packaging for the application space that Matt mentioned earlier, we also need to look at each of the elements of design, materials, assembly, reliability, and metrology. ose are highlighted in this paper. Devan, will you discuss the difference between CLP and SLP? Matt Kelly