Issue link: https://iconnect007.uberflip.com/i/1528798
52 SMT007 MAGAZINE I NOVEMBER 2024 is portfolio of reports started with advo- cacy, but we're going deeper into the actual sub- ject matter, answering questions like: "What types of technical challenges are there? What do companies need and want to be standardized in their factories and trained with their work- force?" We've been working at the highest lev- els within various governments, including the U.S. government, the European Parliament, and Asian governments, including Japan and others. You'll also notice that we write on topics that are top of mind in the industry. We're always writing about the latest needs and wants, giv- ing our members as much insight as possible. Iyer: IPC member companies typically consist of OEMs, EMS suppliers, and PCB fabs. Mean- while, component-level packaging is primar- ily done by OSATs and IDMs. at places sys- tem-level packaging with the OEMs, EMS sup- pliers, and PCB designers and manufacturers. is white paper addresses the challenges for component-level packaging as they integrate into system-level packages. In other words, we are trying to connect the CLP and SLP. What trends does the component-level pack- aging community bring to the system-level packaging space? is white paper acts as a pre- lude to assessing the industry interests as well. The OEMs own the big-picture view here. Their perspective and intellectual property are what connect the silicon to systems. Iyer: OEMs own connecting the dots all the way from device to package, from single-chip package to multi-chip package to a board to the system assembly. As chip technology moved quickly, component-level packaging technology lagged behind. at gap is getting closed now. Now, system-level packaging also needs to close the gaps. e question is how do we close the gap between component- and system-level packaging? Your team is not exactly resting on its lau- rels after this report. You've already gone to another level of detail with a subsequent report published recently. Kelly: Right. e follow-up report, which was released in early October, is on AI-based data centers in the United States. is is an exam- ple of a regional report and a study that Devan, Chris Mitchell, and I worked on. It has many of the same elements in terms of flow. Devan has been with us for less than a year and has already helped us tremendously. We're build- ing IPC's expertise in silicon-to-systems tech- nology capability. As we do that, we continue to produce meaningful and valuable research, white papers, and industry intelligence reports. Matt and Devan, why does all this matter? Kelly: We are at the beginning of a 10-plus- year disruptive change. If you are a component maker somewhere in that supply chain, you're already seeing these changes. Silicon is being stitched in different ways: You have to put it on different substrates and package it differently; we're stacking everything. If you're in the com- ponent-level packaging realm, you're seeing the impacts of this disruptive change. Now, if you're more on the PCB fabrication, printed circuit board assembly, or final system-level packaging side, you may not see this yet, but it is coming fast—and it matters. Thank you. SMT007 Downloads: • AI white paper form • Advanced packaging video • Advanced packaging white paper form " We are trying to connect the CLP and SLP. "