Design007 Magazine

4 DESIGN007 MAGAZINE I DECEMBER 2024 FEATURE INTERVIEW Effects of Advanced Packaging on Stackup Design with Kris Moyer FEATURE ARTICLE Are Our Rules No Longer Valid? by Cherie Litson FEATURE COLUMNS A Stack of Advanced Packaging Info by Andy Shaughnessy AI-driven Inverse Stackup Optimization by Barry Olney Advanced Packaging Technologies: Look Before You Leap by Kelly Dack Advanced Semiconductor Packaging Impact on PCB Stackup by Vern Solberg 10 14 8 20 32 40 DECEMBER 2024 • FEATURE CONTENTS This month, expert contributors discuss the impact of advanced packaging and stackup design— from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI. We learn that with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging. Advanced Packaging and Stackup Design 10 20 14 32 40

• Design007 Magazine — December 2024
• Feature Contents–Advanced Packaging and Stackup Design
• Additional Contents
• Column–A Stack of Advanced Packaging Info
• Short–Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
• Feature Q&A–Effects of Advanced Packaging and Stackup Design
• Feature Article–Are Our Stackup Rules No Longer Valid?
• Feature Column–AI-Driven Inverse Stackup Optimization
• Interview–IPC, FED Partner for New Design Conference in Vienna
• Short–New Research Used Plasma Dynamic Synthesis to Produce Carbide and Carbonitride
• Feature Column–Advanced Packaging Technologies: Look Before You Leap
• Feature Column–Impact of Advanced Semiconductor Packaging on PCB Stackup
• Column–Designing for Reality: Solder Mask and Legend
• Article–UHDI Bleeding-edge Manufacturing Applications, Part 2
• Column–Another PCB Design Paradigm Shift in the Works
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
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