IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1531444
IPC COMMUNITY 46 WINTER 2025 Standards Update Newly Published Standards and Revisions IPC-7095E Design and Assembly Process Guidance for Ball Grid Arrays (BGAs) IPC-7095E describes design and assembly implemen- tation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. The standard provides valuable and practical infor- mation to those who use or are considering using BGAs, descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly. IPC-8401 Guidelines for In-Mold Electronics IPC-8401 provides guidelines for in-mold electron- ics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrates printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart-molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration. IPC-2294 Design Standard for Printed Electronics on Rigid Substrates IPC-2294 establishes specific requirements for the design of printed electronics applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive. IPC-6904 Qualification and Performance Specification for Printed Electronics on Rigid Substrates IPC-6904 establishes and defines the qualification and performance requirements for printed elec- tronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive. IPC-HERMES-9852-v1.6 The Global Standard for Machine-to- Machine Communication in SMT Assembly IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manu- facturer, large or small, to align their companies with smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities. IPC-4562B Specification for Metal Base Copper Clad Laminates for Printed Boards IPC-4562A covers metal-unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status