IPC COMMUNITY 46 WINTER 2025
Standards Update
Newly Published Standards and Revisions
IPC-7095E
Design and Assembly Process Guidance for
Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implemen-
tation for ball grid array (BGA) and fine-pitch BGA
(FBGA) technology, focusing on inspection, repair,
and reliability issues associated with design and
assembly of printed boards using these packages.
The standard provides valuable and practical infor-
mation to those who use or are considering using
BGAs, descriptions of how to successfully implement
robust design and assembly processes for printed
board assemblies using BGAs, as well as ways to
troubleshoot some common anomalies that can
occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electron-
ics (IME) manufacturing processes, part structures,
candidate materials, and production test methods.
In-mold electronics integrates printed electronics
and electrical components into injection-molded
plastics, creating a three-dimensional smart-molded
structure. IME technology uses mass production
processes, materials, and components. IME parts
are structural electronics characterized by their
light weight, thinness, robustness, and seamless
integration.
IPC-2294
Design Standard for Printed Electronics
on Rigid Substrates
IPC-2294 establishes specific requirements for the
design of printed electronics applications and their
forms of component mounting and interconnecting
structures on rigid substrates. Rigid substrates, as
applies to IPC-2294, are those that are not required
to be flexed into a new shape for the purposes of
assembly or operation. The rigid substrate can be
conductive (e.g., rigid printed board or assembly),
semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification
for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification
and performance requirements for printed elec-
tronics and their forms of component mounting and
interconnecting structures on rigid substrates. The
substrate can be conductive, semiconductive, or
nonconductive.
IPC-HERMES-9852-v1.6
The Global Standard for Machine-to-
Machine Communication in SMT Assembly
IPC-HERMES-9852 provides a state-of-the-art
communication protocol for machine-to-machine
communication for surface-mount technology.
Used with IPC-2591, Connected Factory Exchange,
IPC-HERMES-9852 can assist any electronics manu-
facturer, large or small, to align their companies with
smart manufacturing and Industry 4.0. Version 1.6
includes updates to SendBoardInfo and capabilities
for Hermes-enabled equipment to be queried on its
Hermes capabilities.
IPC-4562B
Specification for Metal Base Copper Clad
Laminates for Printed Boards
IPC-4562A covers metal-unsupported foils and foils
supported by carrier films suitable for subsequent
use in printed boards. IPC-4562B addresses the
requirements of metal foils used in printed wiring
applications.
To view a complete list of newly published standards and standards revisions, translations,
proposed standards for ballot, final drafts for industry review, working drafts,
and project approvals, visit ipc.org/status
