IPC International Community magazine an association member publication
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IPC COMMUNITY 86 WINTER 2025 Meet the Team Devan Iyer, Ph.D. Chief Strategist, Advanced Packaging Devan joined IPC in March 2024. He has more than 35 years of global executive leadership experi- ence in the electronic component and system industry, focusing on technology, manufactur- ing, and business development. He has led global cross-functional teams and supply chains to deliver electronic components and advanced semiconduc- tor packaging processes for customers in the com- puting, communication, industrial, automotive, and defense sectors. Devan drives the advanced packaging initiative in IPC in the following ways: • He works with companies and governments to identify and deliver new solutions to IPC mem- bers and the industry. He has been instrumental in bringing new strategies and partnerships for the Solutions Team, in general, and advanced packaging initiatives, in particular. • He is leading IPC to connect component-level packaging to PCB and EMS providers, and released a white paper in September 2024, coauthored with Matt Kelly. • The partnership he is establishing with the IEEE Electronics Packaging Society for chapters in the Heterogeneous Integration Roadmap will help to connect component-level and system-level packaging and develop new roadmap chapters; his partnership with Purdue University's Atalla Institute for Advanced System Integration and Packaging (ASIP) will strengthen IPC's ability to contribute to advanced electronic packaging. • On the thought leadership front, Devan was instrumental in positioning IPC amongst indus- try leaders: ° He participated in an expert panel, "Chiplet for Automotive," at the 2024 IEEE 10th Elec- tronics System-Integration Technology Con- ference (ESTC) in Berlin in September 2024, along with experts from NVIDIA, Renault, TSMC, Infineon, and IMEC. ° He delivered a keynote speech on advanced packaging customization trends and standard- ization opportunities at the 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) in Singapore in December 2024. It was attended by more than 650 experts from industry and academia. • As a trusted advisor to global governments on topics related to electronic components, semi- conductors, and advanced packaging. Devan provides advocacy support to the IPC Govern- ment Relations Team: ° He is developing technology project partner- ships with companies and academic institu- tions and submitting funding proposals to DOC/NIST organizations. This includes sev- eral meetings with the U.S. Departments of Defense and Commerce as part of the team's trusted advisory role and technical discus- sions with academic institutions. • By establishing IPC's involvement in advanced packaging in Southeast Asia. Contact: DevanIyer@ipc.org, or visit Advanced Packaging Semiconductors | IPC Industry Initiatives