IPC International Community magazine an association member publication
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IPC COMMUNITY 31 WINTER 2025 progress. However, consumer electronics face challenges, and their efforts need to be scaled up. Standardization and adoption of digital product passport technologies and practices to moni- tor, track, and manage the movement of goods throughout the supply chain could act as a cata- lyst for the development of these technologies. • Product design for circularity: A proactive design approach with circularity in mind and the devel- opment of supporting tool capabilities, can greatly optimize effective end-of-life manage- ment efforts, while not compromising on prod- uct performance and reliability. • Education: Workforce development and training of engineers in practice are needed to promote circularity. From Reactive to Proactive Industry Approaches to Materials Selection From a materials perspective, sustainable elec- tronics means higher material efficiency and improved functionality, while utilizing materials with lower environmental impacts and human health risks. That combination calls for an industry approach that moves from reactively responding to regulation to proactively addressing sustainability issues: • Selecting materials that minimize greenhouse gas emissions • Proactively identifying and addressing health and ecotoxicity concerns • Building secure and socially responsible supply chains • Researching material reuse and recycling to support a circular economy The iNEMI Roadmap also identifies and character- izes critical raw materials and compounds by various dimensions of sustainability. The expected technical maturity of various approaches to recycling and reuse of different materials is mapped over time; an example is shown in Figure 3. Roadmapping Ecological Footprint Reduction The electronics manufacturing industry is heavily focused on optimizing resource-intensive manu- facturing processes. Key targets are energy-efficient production and responsible water management. Fur- thermore, biodiversity impact from land footprint is an increasing concern, particularly for new builds. While IEEE's International Roadmap for Devices and Systems (IRDS) has addressed the energy and water footprint for semiconductor fabrication, there is a gap in technology roadmaps for PCB fabrication and board assembly processes. iNEMI will address this gap by roadmapping the ecological footprint of these important parts of the electronics supply chain. Electronics Manufacturing—An Industry in Transition The challenge of sustainability is driving electron- ics manufacturing to revisit its materials, processes, and design methods. In some cases, sales and after- care models will also change, again requiring tech- nology advancements to support repair, recycling, and reuse. It is a challenge that is posed by all stake- holders, from customers, governments, sharehold- ers, and from within the industry itself. However, it is a challenge that can and will be met through tech- nology and business innovation. This transformation not only promises to reduce environmental impact but also opens new opportu- nities for growth. By embracing sustainability, the electronics industry has the potential to set a bench- mark for responsible innovation across sectors. About the authors Thomas Okrasinski is director of Product Environ- mental Engineering for Nokia Bell Labs; and Fu Zhao is professor of Mechanical Engineering and Environ- mental and Ecological Engineering at Purdue Uni- versity. They are co-chairs of the iNEMI Sustainable Electronics Roadmap. Francis Mullany is iNEMI's director or Roadmapping. HOW TO ENGAGE WITH THE INEMI ROADMAP iNEMI will host an online webinar on Feb. 13, 2025, to kickoff roadmap work on ecological footprint reduction. Click here for details and to register. Industry experts are needed to join existing roadmapping teams across a range of topics. If you're interested, send an email to roadmap@inemi.org for more details.