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JANUARY 2025 I PCB007 MAGAZINE 81 What advice do you have for other young people who are struggling to make a career choice and may be considering a career in manufacturing? Telesca: You need to put yourself out there and not be afraid to try something different. I never thought in a million years I'd be working for a company that makes machines. Like Tony tells us, "Don't be afraid to say 'yes,' because that opens doors." Put yourself out there and don't be afraid. e worst thing that can happen is you discover that something is not for you. Moore: Especially in my pro- fession where ever yone is look- ing to work for one of the big- five soware companies, it's important to open your mind to new and different opportu- nities. You don't know what you could be missing. is job Purdue University Wins Microelectronics Commons Project to Advance AI Hardware Through the Silicon Crossroads Microelectronics Commons Hub is interesting, and ever y day presents new challenges and new things to learn. I could be coding all day long in an office cubicle or working from home, but here I get to play with many types of devices and learn how they work. We're working with robots, and different types of sensors and cameras. ere is a lot to be said about working in an industry where you get to come into a building and see your colleagues and teammates, not just via online meetings and emails. It has been good talking to you both. I wish you both contin- ued success in your careers. We are fortunate to have you working in our industry. Telesca: ank you, Marcy. is has been a great opportunity. PCB007 A Purdue University-led team is the winner of a new project to advance artificial intelligence hard- ware through the Microelectronics Commons pro- gram in collaboration with the Silicon Crossroads Microelectronics Commons (SCMC) Hub. Purdue's project—CHEETA: CMOS+MRAM Hard- ware for Energy-EfficienT AI—will adopt a CMOS+X approach, specifically leveraging the unique capa- bilities of magnetic random-access memory (MRAM) to design efficient in-memory computing hardware fabrics. This project will pursue lab-to-fab transi- tion of pioneering research performed at Purdue for over a decade. The project was one of four has announced that received funding from the Applied Research Insti- tute. SCMC, which is led by ARI, is one of eight national hubs led by ARI and comprising an innova- tion ecosystem of diverse partners driven to accel- erate expansion of America's microelectronics base. Purdue President Mung Chiang said, "Purdue is strongly committed to supporting the CHIPS Act and the U.S. DOD's ME Commons program, enhanc- ing economic prosperity to the Silicon Heartland and national security of the U.S." The Purdue-led team includes the following faculty from the Elmore Family School of Electrical and Com- puter Engineering: Kaushik Roy, the Edward G. Tiede- mann, Jr. Distinguished Professor of ECE; Anand Rag- hunathan, the Silicon Valley Professor of ECE; and Sumeet Gupta, Elmore Associate Professor of ECE, with collaborating partners Everspin Technologies, Georgia Institute of Technology, Naval Surface War- fare Center Crane Division, Argonne National Labora- tory, University of Michigan and Northrop Grumman. The project will receive $21 million over four years. (Source: Purdue University)