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48 PCB007 MAGAZINE I JANUARY 2025 advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems. A Global Hub of Innovation and Growth APAC is uniquely positioned to shape the future of electronics manufacturing with its strong industrial base, strategic location within global supply chains, and significant invest- ments in technology and talent. Countries such as Malaysia and ailand are at the forefront of this transformation. ey are leveraging their strengths to create cutting-edge ecosystems for semiconductor advanced packaging, package substrate and PCB manufacturing. Thailand: A Rising Star Recently, ailand is attracting significant investment from global electronics giants and is rapidly emerging as a key player in PCB manufacturing. While cost efficiency has tradi- tionally been the driving force for manufactur- ing in Southeast Asia, supply chain diversifica- tion is now a key driver. A broader shi in the global electronics land- scape is reflected in ailand's emergence as a PCB manufacturing hub. rough investments in technology and capac- ity, the country is creating a vibrant ecosystem for advanced electronics manufacturing. It is positioning itself as a leader in Southeast Asia's elec- tronics sector by attracting key indus- try players to provide cutting-edge manufacturing processes and build capacity for high-performance PCBs. Malaysia: Advancing Semiconductor Technologies Malaysia is another key player in the APAC region that continues to see foreign direct investment in semiconductor and advanced electronics manufacturing. High-performance computing, automotive applications, and industrial IoT solutions are the focus of com- panies setting up operations here. e coun- try's robust infrastructure and skilled work- force are attracting global companies to set up advanced manufacturing facilities. ese fur- ther cement Malaysia's role as a key player in heterogeneous integration and semiconductor advanced packaging. Strategic investments in advanced manufac- turing facilities and technical centers are help- ing the country's manufacturers keep pace with the growing demand for state-of-the-art semi- conductor, package substrate, and printed cir- cuit board solutions. Driving Innovation Through Sustainability Alongside technological advances, sustain- ability is at the forefront of electronics manu- facturing practices in APAC. Reducing water consumption, improving energy efficiency, Malaysia MKS' Super Center concept design.