PCB007 Magazine

PCB007-Jan2025

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info @ atotech.com www.atotech.com The revolution of electroless copper activation To find out more about Cupraganth ® MV at MKS' Atotech, scan the QR Code to the right. Cupraganth ® MV – Redefining electroless copper ac va on Cupraganth MV is the world's first Pd-free electroless copper activation solution. It is transforming the manufacture of substrates for advanced packaging. Based on an innovative colloidal copper technology, it supersedes traditional Pd-based methods and delivers both performance and cost benefits. As the Cupraganth MV layer is removed simultaneously with the bulk copper layer, you can simplify your process and achieve finer features by eliminating the need for an additional Pd seed etch. Additionally, take ad vantage of the stable price of copper to ensure a lower cost of ownership (CoO) with greater financial predictability. Cupraganth MV offers improved yields, and finer track spacing, and works seamlessly with tartrate-based electroless copper baths. The robust and efficient 4-step process assures exceptional coverage and peel strength comparable to ionic Pd technology. Choose Cupraganth MV for superior performance, reduced costs, and breakthrough innovation in package substrate manufacturing.

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