Issue link: https://iconnect007.uberflip.com/i/1531663
76 PCB007 MAGAZINE I JANUARY 2025 glass yarn and threads, resulting in thinner cores and prepregs 1,3 : • 1015: 0.014 mm • 1027: 0.020 mm • 101: 0.024 mm • 1037: 0.033 mm • 106: 0.033 mm • 1067: 0.035 mm • 1078: 0.043 mm • 1080: 0.053 mm • 1086: 0.054 mm AGC has also compared its build-up films with other UHDI films for warpage/bow across large panels. Minimizing warpage is important for the larger mega-module BGAs of AI and HPC (Table 6). Other UHDI Materials Other laminate manufacturers have thin product lines of supported resins (Dicy-Phe- nolic-Halogen-free and polyimides) 3 like Ven- tec's Bondply and RCCs, as seen in Figure 2. Table 5: Examples of thin substrate cores and their properties 2 . Table 6: Three build-up films compared for warpage and bow across a large fabrication panel 2 .