SMT007 Magazine

Visit us at APEX! Booth #1416 indium.com ©2025 Indium Corporation Excellent drop shock reliability in low-temp applications and TCT 15% * energy savings Reflow temperature 200–240°C *Dependent on process Enhanced thermal cycling performance Superior voiding performance Reflow temperature 235–250°C High transfer efficiency and exceptional SPI yield High oxidation resistance to eliminate graping in air reflow Low BGA, CSP, LGA, and QFN voiding Indium12.9HF THE NEXT EVOLUTION OF SOLDER

• SMT007 Magazine — March 2025
• Featured Content — Your Golden Ticket to IPC APEX EXPO
• Additional Content
• Feature Column — Your Golden Ticket
• Feature Column — IPC APEX EXPO 2025 Marks a Special Anniversary Year for the Show
• 25 Years of IPC APEX EXPO Keynotes
• Feature Interview — Imagine the Possibilities: Tech Conference 2025
• Column — Training the Next Generation of Talent
• Feature Article — An Overview of the Keynote Presentations
• The Top 5 Things You Need to Know About…
• The Top 5 Things You Need to Know About…Manufacturing Training by Blackfox Training
• The Top 5 Things You Need to Know About… Multilayer System Solutions by Burkle North America
• The Top 5 Things You Need to Know About…Cleaning by KYZEN
• The Top 5 Things You Need to Know About…Placement by Mycronic
• The Top 5 Things You Need to Know About…Implementing Smart Automation Solutions by Technica, U.S.A.
• Feature Column — At the Forefront of Electronics Manufacturing
• Short — New Learning Lounge a Hub for Knowledge and Innovation
• Feature Article — IPC Global Standards Driving Factory of the Future
• Short — Make Your Case for IPC APEX EXPO 2025
• MilAero007 Highlights
• Feature Interview — Standards Driving Factory of the Future
• Feature Article — Empowering Women in Electronics: An Evening of Connection and Inspiration
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index