Issue link: https://iconnect007.uberflip.com/i/1534385
52 PCB007 MAGAZINE I APRIL 2025 was silver, first as a paste, then as an electroless conversion. is was later replaced when Shi- pley developed a reliable palladium/formalde- hyde copper reduction process. Together with traditional sputtering and vacuum metal depo- sition, UHDI metallizations have increased to: • Sputtering: Ti/Cu, Indium-tin-oxide (ITO), Carbon nano tube (CNT) (Plasma- LineD, Scheldahl-Viain) • mSAP, amSAP, A/SAPTM with Cu foil (LQDX, ATOTECH, MacDermid, Uyemura) • SAP with electroless copper Cu (ABF, AGC fastRise™) • SAP with additive MOD inks (KDI) • SAP with metallic conductive pastes (Ormet/TLPS, ALIVH, Bbit, PALUP, Parelec/PARAMOD, Namics/Unimac) • Chemical vacuum deposition • EHD: By Scrona allows inkjet printing of resin and metals with features down to 2 μm • QCIATM (Hyperion QCPTM) Table 1: Liquid metal and MOD inks/pastes work with a broad range of dielectric materials 2