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66 SMT007 MAGAZINE I MAY 2025 In electronic assemblies, the integrity of connections between components is para- mount for ensuring reliability and perfor- mance. Gold embrittlement and dissolution are two critical phenomena that can com- promise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittle- ness and an increased susceptibility to crack- ing. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electri- cal and mechanical properties of the joint. Knocking Down the Bone Pile Column by Nash Bell, BEST, INC. Gold Mitigation Understanding the mechanisms and effects of both processes is essential for engineers seeking to enhance the durability and func- tionality of electronic devices in demanding environments. ere are advantages and disadvantages to gold finishes on electronic components. Gold doesn't tarnish, provides a highly sol- derable surface, boasts a long shelf life, and resists oxidation. However, as illustrated in Figure 1, gold is porous and can dissolve in eutectic tin-lead solder, leading to embrittle- ment and weakened solder joints. for Class 2 Electronics