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72 SMT007 MAGAZINE I MAY 2025 taminated solder can result in issues other than gold embrittlement such as poor solder- ability and reduced electrical performance. Reduce the chances of these issues by test- ing solder pots regularly via X-ray fluores- cence (XRF) to ensure the solder purity stays within acceptable ranges. In conclusion, mitigating excessive gold plating is crucial for enhancing the reliability of Class 2 electronic assemblies. While tradi- tional manual methods using a single static solder pot may appear cost-effective, they present challenges that can negatively impact the transfer of gold and other contaminants, leading to gold-rich and de-wetted solder joints. For optimal results, use advanced techniques, such as the robotic hot solder dip process. is method improves control over the gold mitigation process, safeguards against contamination, and ensures a con- sistent, high-quality intermetallic bond. By adhering to industry standards and using the right equipment, manufacturers can enhance solderability and reliability, ultimately pro- ducing more dependable electronic compo- nents and assemblies. Future columns will explore various aspects of the robotic hot solder dip pro- cess, with further insights and best practices to improve quality and performance in elec- tronic device assembly. SMT007 Nash Bell is president of BEST, Inc. To read past columns, click here. Transforming Semiconductor Inspection Employing AI Technology with David Chiu, Test Research Inc. Test Research Inc. (TRI) uses advanced technology to tackle challenges in inspecting tiny components. Their AI programming reduces coding time by 75%, enhancing efficiency in inspections.