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34 SMT007 MAGAZINE I JULY 2025 by N a s h B e l l , B EST, I n c . Solving the Toughest BGA Challenges in Electronics S ince the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for elec- tronic devices. Compared with high- density ultra-fine pitch quad flat packs (QFPs), BGA packages signifi- cantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%. Integrating standard BGAs and their stacked counterpart, pack- age-on-package (PoP), can further increase density, facilitating greater design flexibility for compact and effi- cient circuit designs in applications ranging from consumer electronics to automotive systems and medical devices. Despite these advantages, the complexity of BGA packages introduces challenges during rework, requiring innovative methods and thorough inspection practices to main- tain performance and reliability. BGA rework involves removing and replacing BGA packages on printed circuit boards because of defects, upgrades, and/or failures (Figure 1). This process is vital for ensuring the integrity and functionality of electronic devices. Engineers employ sev- eral techniques, each offering distinct advantages and requiring careful consideration based on specific applications. There are many methods available for removing and replac- ing BGA components. The exact method will be determined by several factors, including available equipment, board density, and repair technician skill level. These methods include: ▼ Figure 1: Hot air rework uses a stream of hot air to heat the BG A and PCB uniformly. F E AT U R E A RT I C L E