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32 DESIGN007 MAGAZINE I JULY 2025 U ltra high-density interconnect (UHDI) technol- ogy is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-per- formance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 tech- nologies, highlighting applications, benefits, and future directions. Industry 4.0 represents the convergence of cyber-physical systems, Industrial Internet of Things (IIoT), artificial intelligence (AI), and auto- mation to revolutionize modern manufacturing and production. Central to this transformation is the need for compact, reliable, and high-perfor- mance electronics. UHDI technology—featuring ultra-fine traces, microvias, and embedded pas- sive components—offers the physical backbone to meet these demands. Overview of UHDI Technology UHDI is a class of advanced PCB technology char- acterized by: • Line/space geometries of 25 µm or less • Laser-drilled microvias (often stacked or staggered) • Embedded passives (resistors, capacitors) • Advanced materials for high-frequency performance These features enable a higher density of inter- connections within smaller footprints, improve elec- trical performance, and enhance mechanical reliabil- ity—key factors in Industry 4.0 environments. U H D I F U N DA M E N TA LS by A n a ya Va rd ya , A m e r i c a n S ta n d a rd C i rc u i t s UHDI Technology and Industry 4.0