Issue link: https://iconnect007.uberflip.com/i/1538100
A RT I C L E by A l a n G a rd n e r, M a c D e r m i d A l p h a E l e ct ro n i c s S o l u t i o n s Integrated Solutions for Board-level Reliability: A Smarter Path Forward In today's electronics manu- facturing landscape, reli- ability is no longer just a bench- mark but a business imperative. As industries such as automo- tive, aerospace, and high-per- formance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater. Ensuring board-level reliability (BLR) is no small feat. From ther- mal cycling to mechanical stress and electrochemical degrada- tion, the challenges are complex, and the consequences of failure are significant. The Connection Challenge The solder joint at the PCB interface is a critical reliabil- ity determinant that demands 34 SMT007 MAGAZINE I AUGUST 2025 close attention during layout and material selection. As board designs push toward higher component densities, finer pitches, and increased thermal cycling demands, these connec- tions often become the domi- nant failure mode. The interaction between sol- der alloy composition and rein- forcement polymer material directly influences the mechani-