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Excellent drop shock
reliability in low-temp
applications
and TCT
15%
*
energy savings
Reflow temperature
200–240°C
*Dependent on process
Enhanced thermal
cycling
performance
Superior
voiding
performance
Reflow temperature
235–250°C
High transfer efficiency
and exceptional SPI yield
High oxidation resistance
to eliminate graping in
air reflow
Low BGA, CSP, LGA,
and
QFN
voiding
Indium12.9HF
OF
NEXT
SOLDER
EVOLUTION
THE
