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28 DESIGN007 MAGAZINE I AUGUST 2025 • AIoT (Artificial Intelligence of Things): Smart edge devices in homes, cities, and industrial setups use UHDI for multi-sensor and compute integration. Emerging Trends • Chiplet integration: UHDI provides the fine-pitch inter- connects needed for modular chiplet-based AI processors. • Neuromorphic computing: Brain-inspired systems require ultra-dense, low-latency routing—UHDI is ideal. • Flexible and wearable AI: UHDI on flexible substrates enables high-performance AI in bio-integrated and wearable devices. • Thermal-aware AI design: UHDI's shorter paths and layer management improve heat dissipation. Strategic Advantages of UHDI for AI • Miniaturization: More functionality in less space • Performance: Higher clock speeds with reduced signal degradation • Reliability: Tolerates harsh environments and continuous AI workload • Energy efficiency: Critical for battery-pow- ered and mobile AI devices Conclusion UHDI is more than a manufacturing innovation. It is a fundamental enabler of the AI revolution. From real-time edge inference to energy-efficient neural processing and AI-powered wearables, UHDI pro- vides the interconnect density, signal integrity, and reliability required for AI systems to thrive in mod- ern applications. As AI systems evolve, the role of UHDI in ensuring their performance and scalability will become even more central. DESIGN007 Anaya Vardya is president and CEO of American Stan- dard Circuits; co-author of The Printed Circuit Design- er's Guide to… Fundamen- tals of RF/Microwave PCBs and Flex and Rigid-Flex Fun- damentals. He is the author of Thermal Management: A Fabricator's Perspec- tive, The Printed Circuit Designer's Guide to DFM Essentials, and The Companion Guide to Flex and Rigid-Flex Fundamentals. Visit I-007eBooks.com to download these and other free, educational titles. A I Syste m Re q u i re m e nt s Ad d re s s e d by U H D I