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10 DESIGN007 MAGAZINE I AUGUST 2025 Major Circuit Blocks Key components, such as processors, FPGAs, and power supplies, must be strategically placed on the board. These major circuit blocks should be positioned in a way that facilitates optimal signal routing and minimizes interference. High-speed and Critical Signals Certain signals—like DDR routing, high-speed differential pairs, RF signals, and other sensitive signals—require special attention. These signals are vulnerable to noise, and improper routing can lead to performance degradation. Designers must prioritize the placement of these components to minimize signal loss or distortion. Connector Locations Connector placement is another crucial factor in floor planning. Connectors should be strategically positioned to simplify external connections and avoid interference with other components or circuits. Mechanical Considerations The physical constraints of the board, such as its size, shape, mounting holes, and cutouts, influence the layout. These features are often pre- defined early in the design process, which means that PCB designers must adapt their component placements to these restrictions. Schematic Capture While schematic capture is a separate pro- cess, it can play a significant role in guiding the floor planning phase. By referencing the schematic, designers can verify the correct placement of components and check the flow of critical signals through the system. Although schematic capture and floor planning are distinct, sche- matic notes can help guide the floor planning process by offering insights into signal relationships and power needs. Monsoon's Floor Planning Process Monsoon Solutions is an engineering services and consulting company that specializes in PCB design and manufacturing. We begin floor planning with input from the mechanical design team, as the placement of mechanical features (like mounting holes or cutouts) is often locked early in the design. Starting with these mechanical constraints is essential to avoid having to make significant adjustments later on. Once mechanical features are established, the next step is placing components that have fixed posi- tions, such as connectors or ICs that interact with mechanical elements, like heat sinks. From there, the designer examines the schematic to assess how criti- cal signals flow through the system. For example, if there are differential pairs coming from a connec- tor to an FPGA, the designer will ensure that the signal path is as direct and noise-free as possible. For high-speed and sensitive signals like DDR routing, the goal is to ensure that the signal trav- els along the shortest and least obstructed path. After addressing signal routing, the next priority is power distribution. Power circuits should be placed efficiently, with a logical flow from input power to power supplies and eventually to the destina- tion components. Designers should also consider voltage drop issues, placing low-voltage supplies close to the circuits they power. Challenges in Floor Planning Despite careful planning, designers often face sev- eral challenges during the floor planning process. One of the primary hurdles is dealing with mechan- ical features, such as multiple mounting holes or cutouts. These features can obstruct the efficient placement of components and routing of signals. Sometimes, component density becomes an issue, and the board layout may need to be revised to accommodate space constraints. Cli- ents often recognize space limitations early on and provide guidance on which design aspects can be adjusted to resolve the issue. Another challenge is stackup decisions. Choos- ing the correct stackup is essential for ensuring signal integrity and managing electromagnetic interference (EMI). Controlled impedance, mechan- ical restrictions, and board cost can also factor into stackup decisions. 2 1 3 4 5 C or y Grunwald