Community Magazine

Community-Fall2025

IPC International Community magazine an association member publication

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4 8 C O M M U N I T Y M A G A Z I N E FA L L 2 0 2 5 To view a complete list of published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, click here. Standards Update IPC-4556A Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards This performance specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/Immer- sion Gold (ENEPIG) as a surface finish for printed boards. This performance specification defines ENEPIG deposit thicknesses for applications including soldering, wire bonding, and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electron- ics manufacturing services (EMS), and original equipment manufacturers (OEM). This standard may be used to spec- ify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 series (IPC- 6012, IPC-6013, and IPC-6018) of standards. IPC-2591 V2.0 Connected Factory Exchange (CFX) This standard establishes the requirements for the omnidi- rectional exchange of information between manufacturing processes and associated host systems for assembly manu- facturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies—automated, semiautomated, and man- ual—and is applicable to related mechanical assembly and transactional processes. This Connected Factory Exchange (CFX) standard provides a true ''plug and play'' Internet of Things (IoT) communication environment throughout man- ufacturing, where all equipment, manufacturing processes, and transactional stations can communicate with each other without the need for the development and use of bespoke interfaces. CFX-enabled equipment and solutions from different vendors work seamlessly together. IPC-4203C Cover and Bonding Materials for Flexible Printed Circuitry This standard establishes the classification system, qualifi- cation, and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective, and wave soldering equipment. The docu- ment also includes a troubleshooting guide for addressing common defects that can be attributed to profiling. IPC-8911 Requirements for Conductive Yarns for E-Textiles Applications This standard identifies categories and establishes a designa- tion system and qualification/quality conformance require- ments and test methods for conductive yarns used in e-tex- tiles. The standard enables suppliers of conductive yarns to demonstrate their products' performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for conductive yarns. IPC-8981 Quality and Reliability of E-Textiles Wearables This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors, such as abrasion, flexing, and UV exposure, and environmental conditions, including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14 IPC Test Methods developed specifically for e-textile prod- ucts, the standard also provides guidance for identifying affected and critical areas for reliability testing.

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