7 6 C O M M U N I T Y M A G A Z I N E FA L L 2 0 2 5
I N S T R U C T O R - L E D C L A S S E S
Time is running out to secure your spot in the next lineup of online, instructor-led courses. Classes
begin as early as Oct. 20, and with seats limited, engineers and managers alike are encouraged to
register now to ensure access.
Building Sustainable Model-based PCBs
October 20–November 5 | Instructor: Fil Arzola
Kicking off the October series, this course provides a
practical approach to designing and building sustain-
able model-based printed circuit boards. Participants
will gain insight into balancing design considerations
with environmental and reliability requirements,
preparing them to implement best practices across
product lifecycles.
Advanced Packaging: HDI Enabling Technology
October 20–29 | Instructor: Mike Carano
Industry veteran Mike Carano explores how high
density interconnect (HDI) technology is reshaping
advanced packaging. Engineers will learn about the
critical processes and materials enabling next-gen-
eration packaging, as well as how to apply HDI tech-
niques to improve performance and reliability.
AI Applications of Machine Data in the
EMS Industry
October 21 and 23 | Instructor: Tim Burke
Artificial intelligence is transforming electronics man-
ufacturing. This focused course covers how machine
data can be applied to real-world electronics man-
ufacturing services (EMS) challenges, from defect
detection to predictive maintenance, equipping
participants with actionable strategies.
Flex and Rigid-Flex Design for Manufacturability
October 28–November 6 | Instructor: Nick Koop
Flex and rigid-flex circuits bring new possibilities and chal-
lenges. This new course helps engineers design with man-
ufacturability in mind, ensuring product reliability while
avoiding common pitfalls in fabrication and assembly.
Troubleshooting and Defect Analysis for
Electronics Assembly
November 3–12 | Instructor: Jim Hall
Jim Hall brings decades of experience to this essential
course, guiding participants through the systematic
process of identifying, analyzing, and resolving defects
in electronics assembly. Engineers will leave with a stron-
ger toolkit for ensuring quality on the production floor.
Train the Trainer
November 3–12 | Instructor: Karen Smalls
This course equips participants with essential skills to
deliver engaging and effective workshops, including
facilitation techniques, needs analysis, and managing
technical and challenging topics. Taught by a Certified
Master Trainer, attendees will learn how to create a
comfortable learning environment for CITs or any-
one teaching to an in-house audience that enhances
understanding and participation.
PCB Design for Manufacturability
November 4–20 | Instructor: Dana Korf
Dana Korf leads this deep dive into designing printed
circuit boards that balance innovation with manu-
facturability. Participants will explore design choices
that reduce risk, streamline production, and minimize
costly rework.
Spotlight: Three Courses with Dr. Jennie Hwang
Dr. Jennie Hwang, an internationally recognized
authority on packaging, materials, and reliability,
teaches three courses this November and December.
These courses can be taken individually or as a pow-
erful learning track.
• PoP Packaging and Assembly: Materials,
Processes, Reliability—November 11 and 13
• BTC Packaging and Assembly: Materials,
Processes, Reliability—November
18 and 20
• Reliability of Electronics: Role of Solder
Joint Voids—December
2 and 4
Secure your
seat now at
electronicsu.org
and ensure you're
ready for the
challenges and
opportunities
ahead.
