56 DESIGN007 MAGAZINE I DECEMBER 2025
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DESIGN007 TOP 10
C h e c k o u t t h e s e h i g h l i g h t s f r o m D E S I G N 0 0 7 . c o m
Strong R&D capabilities, the quick
integration of cloud-based tools and AI,
and the need for fast, small electronics
are the main factors propelling the U.S.
market. Its dominance in sophisticated
manufacturing and chip design keeps
driving market expansion and world-
wide competitiveness.
As the electronics industry navigates geopolitical uncertainty
and increased demand for supply chain diversity, there has
never been a better time
to take a close look at U.S.
PCB manufacturing. What
we see is not simply a story
of decline. It embodies
resilience, renewal, and
opportunity.
As devices become increasingly
smaller, smarter, and more connected,
safeguarding them has become more
complex. This article examines the
challenges of protecting modern elec-
tronics, with a particular focus on wire-
less sensor applications where reliable
RF signal transmission and moisture
resistance are critical.
Drilling is already one of the more
complex and tricky steps in the manu-
facturing process. Designers must
consider everything from board thick-
ness and via size to material type to
craft their designs and avoid problems
during drilling that can drive up costs
and increase the risk of board perfor-
mance issues. With UHDI designs
there is a lot for the designer to
consider.
"Cadence delivered excellent results for the third quarter
of 2025. With a record backlog and ongoing broad-based
strength of our business, we are raising our full year
revenue outlook to ~14% growth year-over-year," said
Anirudh Devgan, president and chief executive officer.
PCB Design Software Market
to Hit $12 .11 Billion by 2033,
Growing at a CAGR of 13.77%
Connect the Dots:
Designing for the
Reality of U H DI
PCBs—Drilling
Sealed for Survival:
Potting Electronics
for the Toughest
Environments
Fresh PCB Concepts: Resilience
and Renewal in Domestic PCB Mfg.
Cadence Reports Q3 2025
Financial Results
