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APEX EXPO 2026 puts design front and center with the debut of the Design Village—a new show-floor destination showcasing advanced electronic packaging, system co-design, next-generation EDA tools, multiphysics simulation, and digital manufacturing. At the heart of the Design Village will be the Technology Pavilion, an exposition show floor destination featuring the latest technologies and solutions through a lineup of technical presentations. Together, the Design Village and Technology Pavilion are a hub for engineers and system architects exploring what's next in ultra-HDI, high-speed routing, advanced substrates, and complex PCBAs—featuring perspectives from both established industry leaders and emerging voices shaping the future. Learn more about Design activities at APEX EXPO 2026 and register here: www.apexexpo.org www.apexexpo.org • Advanced Electronic Packaging Conference Advanced Electronic Packaging Conference sessions, with focus areas such as thermal characterization and imaging techniques for IC materials, interfaces, and complete packages • A full-day IPC-2581 Adoption Summit, IPC-2581 Adoption Summit, advancing design-to-manufacturing data interoperability across the industry • Standards development Standards development committee meetings, spanning PCB design rules, Cold Joining/Press-Fit, and Wire Harness design • Keynotes and networking Keynotes and networking events, including futurist Zack Kass and the Design Town Hall which will outline the new IPC-Standard Certification path. • Professional development Professional development courses, courses, from model-based PCB design to high- density semiconductor package technologies with BUNDLE and SAVE Enjoy full show-floor access—covering the Design Village and Technology Pavilion—plus: DESIGN LEADS THE CONVERSATION AT APEX EXPO 2026