IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543307
HDI & UHDI "We're already there!" The Uyemura-MEC Roadmap: Etchbond micro-roughening Anisotropic etchants for sub-40 microcircuitry Differential and flash etchants for mSAP/SAP High frequency, fine pitch final finishes: EPIG / IGEPIG New Substrate Electrolytes: Electroless copper Copper thru-glass via RDL plating Copper post-plating Tin-silver UBM Corporate Headquarters: 3990 Concourse, #425 • Ontario, CA 91764 • ph: (909) 466-5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • Ph: (860) 793-4011 www.uyemura.com Booth 4413