IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543307
24 I-CONNECT007 MAGAZINE I FEBRUARY 2026 for electrical function, electromagnetic compati- bility, and so on. Hence the co-design and system co-optimization aspects will also be discussed. Rak: Thermal management impacts almost every market application, from high-perfor- mance computing for AI applications in a data center, to a microprocessor for advanced driver- assisted system (ADAS). Managing heat is a recur- ring theme across many presentations, with papers on thermal interface materials and specific cooling methodologies. To summarize, the core pillars are still with the conference. We have design and simulation, mate- rials, and components. We have assembly, test, and manufacturing. We have quality, metrology, reliabil- ity, and digital manufacturing. Those core pillars are still there. We're adding the chip-level packaging to the discussion, but we still look at the same five core pillars—not silos—that you need as a founda- tion to be successful. What are each of you most excited about with the changes to the technical conference? Iyer: My excitement centers on this being a confer- ence that connects the component- and system- level packaging worlds. In my decades of experience in this field, I have seen too many conferences and events that are siloed. Our conference will attempt to bring in expertise from the component and system levels to focus on the commonalities in design tools, materials, assembly and test. Having a conference that brings the interdisciplinary expertise from the entire ecosystem together to engage in discussion is unique and that is very exciting to me. Kelly: I'm most excited about the number of OEM and IDM leadership companies that are coming to APEX EXPO. We have IBM, Intel, NXP, AMD, and Raytheon, along with an impressive list of EDA, equipment, and materials suppliers. We have attracted the key movers and tech influencers in the industry, the ones that drive new technologies forward in the core market segments of HP compute, EV/automotive, industrial, aerospace, and defense. This is where the needle is being moved in elec- tronics, and that technology trickles down into other segments over time. This is no longer just a PCB- focused or assembly-based conference, though those segments are absolutely critical to what we're doing. But this approach is through the lens The APEX EXPO Poster Presentations are among the liveliest activities during the week in Anaheim. Udo Welzel and Stan Rak talked about the poster sessions during our interview about the Technical Conference. Marcy LaRont: What's important to know about the poster presentations? Udo Welzel: The poster session has always been an important and exciting part of the conference. Some topics are well-suited to posters, as they allow for a more one-on-one discussion with a presenter. You can be more interactive at a poster than during a presentation. There is, of course, time for Q&A in a technical session, but there is more opportunity for discussion at a poster. There is even a separate call for poster submissions, and we expect a solid poster session this year. It's always fun to see the personal level of engage- ment and deep discussions between some of the poster presenters and the visitors. Welzel: Yes. The poster area also combines nicely with a visit to the show floor. There are some social events, such as an ice cream social, that help create a relaxed atmosphere, encouraging this type of conver- sation at the posters. Stan Rak: Part of what makes the poster session fun is the live judging. From 5 to 6 p.m. Tuesday, the members of the Technical Program Committee judge the posters after the regular conference agenda. The poster presenters are interviewed, the scoring is done, and a winner is decided all within this one-hour period. That's unique to the conference. While every- thing else is pre-planned, this is a more spontaneous, on-the-spot live interaction. The awards are presented right there as well, so that makes it fun. Poster Session a Highlight of the Technical Conference BY MARCY LARONT, I-CONNECT007