IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543307
FEBRUARY 2026 I I-CONNECT007 MAGAZINE 37 Tuesday, March 17 11–11:30 a.m. "Copper Nanoparticle Inkjet on Rigid PCBs: From Prototype to Mass Production This Year" Presenter: Elephantech Inc. 12–12:30 p.m. "Reduce Risk and Improve Reliability with Connected Supply-Chain Data" Presenter: Elisa IndustrIQ USA, Inc. dba CalcuQuote 1–1:30 p.m. "Automated Spatial Micro-sectioning: Advancing Metallography and Correlated Metrology" Presenter: Leeds Engineering and Data Science 2–2:30 p.m. "Meeting Emerging Thermal Challenges of 3D Heterogeneously" Presenter: Dr. Mo. Shakouri, Microsanj, LLC 3–3:30 p.m. "Altium + Global Electronics U: A New IPC-Standard Certification Path" Presenter: Altium 4–4:30 p.m. "How AI and Collaboration Can Level up Your Electronics Supply Chain" Presenter: Timon Ruban, Luminovo GmbH TECHNOLOGY PAVILION PRESENTATIONS SCHEDULE Wednesday, March 18 10–10:30 a.m. "Smarter Boards, Faster Builds: PLM Strategies for Printed Circuit Board Design and Manufacturing" Presenter: PTC 11–11:30 a.m. "AI Agent Swarms Building De-risked Supply Chains in Electronics" Presenter: Banyan.eco 12–12:30 p.m. "IPC-1782 Compliance Made Simple: Ledgit's Factory of the Future Traceability" Presenter: Septillion Technologies 1–1:30 p.m. "Advancements in 2K Conformal Coating" Presenter: Christian Vega, Axxon Mycronic 2–2:30 p.m. "Design Rules for Depaneling and the Potential for Laser Technology" Presenter: Patrick Stockbrügger, LPKF Laser & Electronics 3–3:30 p.m. "Accelerating the Design-Through-Manufacturing Flow and Reducing Manufacturing Costs with DFM and Design-for-Cost Analysis" Presenter: Oren Manor, Siemens 3:30–5 p.m. Design Town Hall To learn more about the presentations at the Pavilion, click here.