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38 I-CONNECT007 MAGAZINE I FEBRUARY 2026 F E AT U R E A RT I C L E BY T H E I - C O N N E C T0 07 E D I TO R I A L T E A M Professional Development Courses for Every Electronics Manufacturing Sector Professional Development Courses at APEX EXPO are designed to give electronics professionals focused, instructor-led learning that connects directly to today's manufacturing reali- ties. The courses are offered Sunday, Monday, and Thursday, and allow attendees to build new skills while still taking part in the broader APEX EXPO experience. With content in design, fabrication, assembly, digital manufacturing, materials, reliability, and sus- tainability, the program offers something for every segment of the electronics supply chain. Design- ers can explore emerging technologies and risk- reduction strategies, fabricators can learn about materials and process control, and EMS providers can sharpen their approach to quality, testing, and data-driven manufacturing. Here are just a few highlights: Paul Cooke of AGC will be teaching a course for designers and fabricators focused on long- term performance, "PCB Design for High Reli- ability." Cooke draws on extensive experience in materials and fabrication to examine how design choices influence reliability outcomes. The course addresses practical considerations such as stack- ups, material selection, and design-for-manufac- turing decisions that help reduce failures before a board ever reaches production. EMS providers and manufacturing engineers looking to better understand artificial intelligence will find value in Dr. Jennie Hwang's "Artificial Intel- ligence and AI-Powered Electronics Manufactur- ing." Rather than treating AI as a future concept, Hwang explores how it is already being applied to process optimization, quality assurance, and manufacturing decision-making. The session helps attendees evaluate where AI can realistically support production today, and where caution is still warranted. Advanced packaging is another area drawing interest across design and manufacturing teams. In "Advanced Packaging for Chiplets and Heteroge- neous Integration," John Lau of Unimicron exam- ines the technical challenges introduced by chiplet architectures and multi-die systems. His course addresses integration approaches, manufacturing constraints, and reliability considerations that are increasingly relevant as packaging becomes a key driver of system performance. Together, these courses reflect the broader goal of the Professional Development program to deliver practical insight from industry experts who understand the pressures facing modern electron- ics manufacturing. I-CONNECT007 To register and view the full list of courses and instructors, click here Pa u l C o o ke